Call for Papers

Download Call for Papers in PDF format. (Japanese version is also available.)

Important Dates


Submission Deadline Notification of 1st Review Notification of 2nd Review Expected Issue Date
Vol.18 February Issue
June 5, 2024 August, 2024 October, 2024 February, 2025
Vol.17 June Issue
October 4, 2023 December, 2023 February, 2024 June, 2024
Vol.17 February Issue
May 31, 2023 August, 2023 October, 2023 February, 2024
Vol.16 June Issue
October 5, 2022 December, 2022 February, 2023 June, 2023
Vol.16 February Issue
June 1, 2022 August, 2022 October, 2022 Feburary, 2023
Vol.15 June Issue
October 6, 2021 December, 2021 February, 2022 June, 2022
Vol.15 February Issue
June 2, 2021 August, 2021 October, 2021 February, 2022
Vol.14 August Issue
December 2, 2020 February, 2021 April, 2021 August, 2021
Vol.14 February Issue
June 3, 2020 August, 2020 October, 2020 February, 2021
Vol.13 August Issue
December 4, 2019 February, 2020 April, 2020 August, 2020
Vol.13 February Issue
June 5, 2019 August, 2019 October, 2019 February, 2020
Vol.12 August Issue
December 1, 2018 February, 2019 April, 2019 August, 2019
Vol.12 February Issue
June 1, 2018 August, 2018 October, 2018 February, 2019
Vol.11 August Issue
December 18, 2017 February, 2018 April, 2018 August, 2018
Vol.11 February Issue
June 2, 2017 (closed) August, 2017 October, 2017 February, 2018
Vol.10 August Issue
December 2, 2016 (closed) February, 2017 April, 2017 August, 2017
Vol.10 February Issue
June 1, 2016 (closed) August, 2016 October, 2016 February, 2017
Vol.9 August Issue
December 4, 2015 (closed) February, 2016 April, 2016 August, 2016
Vol.9 February Issue
June 3, 2015 (closed) August, 2015 October, 2015 February, 2016
Vol.8 August Issue
December 5, 2014 (closed) February 13, 2015 April, 2015 August, 2015
Vol.8 February Issue
June 1, 2014 (closed) August, 2014 October, 2014 February, 2015
Vol.7 August Issue
December 6, 2013 (closed) February 14, 2014 April, 2014 August 2014
Vol.7 February Issue
May 24, 2013 (closed) August 9, 2013 October 30, 2013 February, 2014
ASP-DAC 2013 Special Issue
February 8, 2013 (closed) March 29, 2013 May 17, 2013 August 2013
Vol.6 August Issue
November 28, 2012 (closed) February 8, 2013 April 26, 2013 August 2013
Vol.6 February Issue
May 25, 2012 (closed) August 10, 2012 October 30, 2012 February 15, 2013
Vol.5 August Issue
November 28, 2011 (closed) February 3, 2012 April 19, 2012 August 6, 2012
Vol.5 February Issue
May 27, 2011 (closed) August 12, 2011 October 19, 2011 February 21, 2012
Vol.4 August Issue
November 30, 2010 (closed) February 4, 2011 April 24, 2011 August 10, 2011
Vol.4 February Issue
May 28, 2010 (closed) August 14, 2010 October 22, 2010 February 8, 2011
Vol.3 August Issue
December 1, 2009 (closed) January 29, 2010 April 14, 2010 August 16, 2010
Vol.3 February Issue
June 1, 2009 (closed) August 14, 2009 October 30, 2009 February 15, 2010
Vol.2 August Issue
November 17, 2008 (closed) January 31, 2009 April 13, 2009 August 14, 2009
Vol.2 February Issue
May 23, 2008 (closed) July 31, 2008 October 9, 2008 February 17, 2009
Vol.1 August Issue
December 25, 2007 (closed) February 29, 2008 May 1, 2008 August 27, 2008

Submission Guide

  • Submission must be made through the Taoka system.
  • Authors should prepare submissions as close as possible to the final camera-ready format, i.e., an A4-size double-column format with authorship revealed. Authors are highly recommended to use the IPSJ style file which can be downloaded from the IPSJ web site (Since reviews are not double-blind in T-SLDM, use the style files "ipsjpapers.sty" or "ipsjpapers.cls" as in esample.tex in the Web page to list author names and affiliations). Detailed instructions on the style and format can be found in Information for Authors.
  • Authors of accepted papers must pay publication fee (JPY 12,180 Yen / page).
  • Follow the submission procedure to submit manuscripts to T-SLDM.
  • For more details, please read Information for Authors.
Inquiries should be directed to tsldm-submit (at) sig-sldm.org.
Copyright (C) 2011 IPSJ Transactions on System LSI Design Methodology.